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POP Sockets

For over 2 years, IDI’s PoP test sockets have been providing reliable solutions for both manual and automatic testing of package on package devices. 
The unique ability of our PoP test socket to accurately and simultaneously align both the upper and lower device pads increases fault coverage and lowers the cost of test.

  • Proven design – over 2 years in the field
  • Reliable alignment to the bottom and top side leads
  • Superior Signal Integrity to both packages
  • Interface bandwidths to 10 GHz
  • 0.40mm pitch & above – production ready solutions
  • 0.25mm pitch – in development



Three Basic Designs of PoP Sockets

Memory-Less (ML) PoP Socket

  • Top and bottom access to leads on devices with memory information supplied from the tester thru the socket assembly.

Memory-Bearing (MB) PoP Socket

  • Top and bottom access to leads on devices with a known good memory device contained within the socket assembly providing a temporary connection to the PoP device test.

Manual Test (MT) PoP Socket

  • Top and bottom access to leads on devices with a known good memory device contained within the lid assembly providing a temporary connection to the PoP device test.