• Device contact pitch: 0.35 mm pitch and above
• Operating Temperature Range: -55°C to 120°C
• Device packages: BGA, WLCSP, QFN
• Pin-to-pin tip distance is 0.07 mm – 0.14 mm, depending on the pin used
• Insertions: >500,000
• Innovative beveled offset tip allows for tighter centers, down to 0.25 mm on the device pad